Photonic Computing & Optical I/O
Electrical-photonic co-design for optical I/O, silicon photonics, photonic accelerators and high-bandwidth package-to-package connectivity.
Own the boundary between electronics and photonics: drivers, modulators, detectors, laser integration, optical packaging, thermal control and electrical/optical co-design.
Architecture is stable; technology maturity is not assumed. Public claims are anchored to current authoritative sources and are separated from Aurora concept work.
Technical coverage
Six focused routes keep device physics, interfaces, packaging, controls and verification separable.
Silicon Photonics Platforms
Waveguides, couplers, modulators, detectors and CMOS-compatible integration.
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Optical I/O Chiplets
Co-packaged optical I/O, die-to-die bandwidth and package-edge constraints.
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Drivers, TIAs & Control
High-speed electrical drivers, transimpedance amplifiers and bias/control loops.
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Laser Integration
External, bonded and on-package laser sources, coupling and reliability.
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Photonic Accelerators
Optical matrix operations, analog accuracy, calibration and mixed-domain interfaces.
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Optical Packaging & Test
Fiber attach, alignment, thermal drift, testability and optical/electrical yield.
Open technical route →Photonic Computing & Optical I/O system view
Own the boundary between electronics and photonics: drivers, modulators, detectors, laser integration, optical packaging, thermal control and electrical/optical co-design.