Materials Engineering Interface
Electrical performance depends on conductor, dielectric, semiconductor, magnetic, thermal-interface and packaging materials.
Electrical Systems Participating in this Interface
These branches provide the electrical data, constraints and verification evidence required at the interface.
Semiconductor Physics & Devices
Device physics, junctions, MOS structures, scaling and wide-bandgap technology.
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Semiconductor Fabrication
Wafer preparation, lithography, deposition, etch, doping, CMP and yield.
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PCB Architecture & Design
Board architecture, stackups, layout, HDI, flex/rigid-flex and DFM.
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Power Electronics & Conversion
Regulation, converters, power semiconductors, gate drive, magnetics and protection.
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Packaging / Thermal / Mechanical
BGA/CSP, wafer-level packaging, interposers, thermal paths, cooling and vibration.
Open system →External Division Link
The final Phase-7 root integration will connect this local interface page to the corresponding Aurora division homepage. Keeping the interface local during Phase 6 prevents broken cross-root links while the full Systems package remains isolated.