Mechanical Engineering Systems Interface
Enclosures, thermal paths, vibration, mounting, cooling and electromechanical interfaces determine whether electronics survive the physical system.
Electrical Systems Participating in this Interface
These branches provide the electrical data, constraints and verification evidence required at the interface.
Packaging / Thermal / Mechanical
BGA/CSP, wafer-level packaging, interposers, thermal paths, cooling and vibration.
Open system →
PCB Architecture & Design
Board architecture, stackups, layout, HDI, flex/rigid-flex and DFM.
Open system →
Harness / Connectors / Flex Interconnect
Connector selection, pinouts, cable, shielding, high-speed interconnect and EWIS.
Open system →
Power Electronics & Conversion
Regulation, converters, power semiconductors, gate drive, magnetics and protection.
Open system →
Manufacturing, Test & Reliability
Fabrication, SMT, inspection, ICT/JTAG, environmental test and failure analysis.
Open system →External Division Link
The final Phase-7 root integration will connect this local interface page to the corresponding Aurora division homepage. Keeping the interface local during Phase 6 prevents broken cross-root links while the full Systems package remains isolated.