Prototyping Lab & Validation Interface
Prototype builds, rework, instrumentation, environmental test and failure analysis close the loop between design intent and physical evidence.
Electrical Systems Participating in this Interface
These branches provide the electrical data, constraints and verification evidence required at the interface.
Manufacturing, Test & Reliability
Fabrication, SMT, inspection, ICT/JTAG, environmental test and failure analysis.
Open system →
PCB Architecture & Design
Board architecture, stackups, layout, HDI, flex/rigid-flex and DFM.
Open system →
Sensors, MEMS & Instrumentation
Inertial, pressure, optical, magnetic, thermal and chemical sensing and instrumentation.
Open system →
SI / PI / EMC / ESD
Transmission lines, SerDes, PDN, return paths, grounding, emissions, immunity and ESD.
Open system →
Harness / Connectors / Flex Interconnect
Connector selection, pinouts, cable, shielding, high-speed interconnect and EWIS.
Open system →
Packaging / Thermal / Mechanical
BGA/CSP, wafer-level packaging, interposers, thermal paths, cooling and vibration.
Open system →External Division Link
The final Phase-7 root integration will connect this local interface page to the corresponding Aurora division homepage. Keeping the interface local during Phase 6 prevents broken cross-root links while the full Systems package remains isolated.