Communications, RF & Photonics
RF front ends, microwave links, optical I/O, high-speed serial channels, packaging and signal integrity.
Primary Electrical Engineering Systems
These are the branches most directly involved in architecture, component selection, implementation, verification and lifecycle support for this application.
RF, Microwave & Wireless
Transmission lines, matching, RF front ends, synthesizers, antennas and MMICs.
Open system →
Photonics & Optoelectronics
Lasers, detectors, transceivers, modulators, silicon photonics and optical interconnect.
Open system →
Photonic Computing & Optical I/O
Silicon photonics, optical-I/O chiplets, drivers, lasers, accelerators and test.
Open system →
SI / PI / EMC / ESD
Transmission lines, SerDes, PDN, return paths, grounding, emissions, immunity and ESD.
Open system →
PCB Architecture & Design
Board architecture, stackups, layout, HDI, flex/rigid-flex and DFM.
Open system →
Processors & Compute Devices
CPU, GPU, MCU, DSP, SoC and AI-accelerator hardware.
Open system →
Packaging / Thermal / Mechanical
BGA/CSP, wafer-level packaging, interposers, thermal paths, cooling and vibration.
Open system →Cross-System Interfaces
Electrical design does not stop at the board boundary. These interfaces define where electrical decisions must be coordinated with the other Aurora engineering divisions.