Computing, AI & Data Centers
Dense compute, memory bandwidth, power delivery, thermal management, high-speed I/O and accelerator integration.
Primary Electrical Engineering Systems
These are the branches most directly involved in architecture, component selection, implementation, verification and lifecycle support for this application.
Processors & Compute Devices
CPU, GPU, MCU, DSP, SoC and AI-accelerator hardware.
Open system →
Memory & Storage Electronics
SRAM, DRAM, Flash, HBM, controllers and emerging nonvolatile memory.
Open system →
Digital Logic / FPGA / ASIC / Chiplets
Programmable logic, ASIC flow, hardware acceleration and die-to-die integration.
Open system →
Packaging / Thermal / Mechanical
BGA/CSP, wafer-level packaging, interposers, thermal paths, cooling and vibration.
Open system →
SI / PI / EMC / ESD
Transmission lines, SerDes, PDN, return paths, grounding, emissions, immunity and ESD.
Open system →
Photonic Computing & Optical I/O
Silicon photonics, optical-I/O chiplets, drivers, lasers, accelerators and test.
Open system →
Neuromorphic Computing
Spiking hardware, event-driven routing, local memory/compute and event-based sensors.
Open system →Cross-System Interfaces
Electrical design does not stop at the board boundary. These interfaces define where electrical decisions must be coordinated with the other Aurora engineering divisions.