High-Reliability & Mission-Critical
Derating, redundancy, screening, fault containment, environmental qualification and evidence-driven reliability.
Primary Electrical Engineering Systems
These are the branches most directly involved in architecture, component selection, implementation, verification and lifecycle support for this application.
Manufacturing, Test & Reliability
Fabrication, SMT, inspection, ICT/JTAG, environmental test and failure analysis.
Open system →
PCB Architecture & Design
Board architecture, stackups, layout, HDI, flex/rigid-flex and DFM.
Open system →
Packaging / Thermal / Mechanical
BGA/CSP, wafer-level packaging, interposers, thermal paths, cooling and vibration.
Open system →
Harness / Connectors / Flex Interconnect
Connector selection, pinouts, cable, shielding, high-speed interconnect and EWIS.
Open system →
SI / PI / EMC / ESD
Transmission lines, SerDes, PDN, return paths, grounding, emissions, immunity and ESD.
Open system →
Semiconductor Physics & Devices
Device physics, junctions, MOS structures, scaling and wide-bandgap technology.
Open system →
Cryogenic Electronics
Cryo-CMOS, low-noise amplification, thermal-load wiring and cryogenic packaging.
Open system →Cross-System Interfaces
Electrical design does not stop at the board boundary. These interfaces define where electrical decisions must be coordinated with the other Aurora engineering divisions.